Influence of Short-term Storage on Corrosion Behavior of Copper postprint

Abstract: The influence of short-term storage in dry atmosphere on the corrosion behavior of copper was investigated by means of potentiodynamic polarization, electrochemical impedance spectroscopy, capacitance measurement and array electrode technique. It was found that the surface film on copper presented a p-type semiconductor structure, and the carrier concentration decreased after short-term storage. At the same time, the corrosion potential increased, the corrosion current density decreased, and the surface film inhibited both the cathodic and anodic process. Copper displayed the typical characteristics of localized corrosion beneath a NaCl droplet. After storage, the wet-ability, the corrosion activity as well as the overall average corrosion intensity are reduced, but the local corrosion intensity enhanced.