再结晶退火对高硅电工钢冷轧带材组织、有序结构和力学性能的影响 postprint

Author: 莫远科 ¹ 张志豪 ¹ 谢建新 ¹ 潘洪江 ¹
Institute:

1. 北京科技大学新材料技术研究院,
Submit Time:2016-11-15 17:14:37

Abstract: 采用弯曲实验、拉伸实验、SEM、TEM和EBSD等手段，研究了再结晶退火对高硅电工钢冷轧带材组织、有序结构、力学性能和冷轧成形性能的影响。结果表明，冷轧试样经800?1200℃保温1 h再结晶退火随炉缓冷后，室温塑性大幅下降，可弯曲角度均由冷轧试样的150 °下降至50 °左右，且二次冷轧出现严重的边裂；提高再结晶退火后的空冷或油淬温度、冷却速率可显著提高试样的室温塑性，1000℃保温1 h再结晶退火后，900℃油淬试样的可弯曲角度增大至175 °左右，拉伸断后伸长率由随炉缓冷试样的0.2%提高至5.2%，且二次冷轧基本不出现边裂；提高再结晶退火后的冷却温度和速度显著提高试样的室温塑性的原因，是试样的有序相尺寸明显减小，例如，有序相畴尺寸可从600℃以下油淬试样的约5 μm分别减小至700℃油淬试样的小于50 nm和900℃油淬试样的小于25 nm。

高硅电工钢冷轧再结晶退火有序度力学性能

Link： http://www.ams.org.cn/CN/abstract/abstract24701.shtml
Subject: Materials Science >> Materials Science (General)

Journal:

金属学报

Contribution： Published
Cite as: ChinaXiv:201611.00801 (or this version ChinaXiv:201611.00801V1)
DOI:10.12074/201611.00801V1
CSTR:32003.36.ChinaXiv.201611.00801.V1
TXID： 1041a698-0f4d-4219-91c2-9e06ea153cdc
Recommended references： 莫远科,张志豪,谢建新,潘洪江.再结晶退火对高硅电工钢冷轧带材组织、有序结构和力学性能的影响.金属学报:https://chinaxiv.org/abs/201611.00801.[ChinaXiv:201611.00801V1] (Click&Copy)

Version History

[V1]

2016-11-15 17:14:37

ChinaXiv:201611.00801V1

Download

Related Paper

1. Regulating the NaSex-assisted crystallization of Cu2ZnSn(S,Se)4 film by modifying the reaction between Na source and Se in the co-selenization process	2025-02-13
2. 钙钛矿氧化物氧八面体旋转导致的超晶格半指数峰的模拟分析	2024-07-27
3. 考虑纤维波纹度的单向复合材料代表性体积元生成算法	2024-07-02
4. Stumbling-to-Fetters mechanism and Virginia Creeper model in hydrogel for designing bionic cardiovascular system	2024-05-27
5. Interaction of multiple micro-defects on the strengths and failure mechanisms of UD composites by computational micromechanics	2024-04-09
6. The irradiation behavior of 2M, 3O and 4M polytypes zirconolite solid solutions under α particles	2024-03-20
7. The Energy Response of LaBr3(Ce), LaBr3(Ce,Sr), and NaI(Tl) Crystals for GECAM	2023-12-15
8. Hydrothermal Synthesis and Magnetic Properties of Copper-doped Lead Apatite	2023-12-05
9. 抢占“镓体系”半导体科技制高点助力实现光电子信息产业的率先突破	2023-08-23
10. 泡沫混凝土的应用	2023-08-14


Public comments Anonymous comments Send only to author