Graphene woven fabric-reinforced polyimide films with enhanced and anisotropic thermal conductivity

分类： 物理学 >> 普通物理:统计和量子力学,量子信息等 提交时间： 2017-05-02

Gong, JR [Gong, Jinrui][ 1,2 ] Liu, ZD [Liu, Zhiduo][ 2 ] Yu, JH [Yu, Jinhong][ 2 ] Dai, D [Dai, Dan][ 2 ] Dai, W [Dai, Wen][ 2 ] Du, SY [Du, Shiyu][ 3 ] Li, CY [Li, Chaoyang][ 4,5 ] Jiang, N [Jiang, Nan][ 2 ] Zhan, ZL [Zhan, Zhaolin][ 1 ] Lin, CT [Lin, Cheng-Te][ 2 ]

摘要： Due to the growing needs of thermal management in modern electronics, polyimide-based (PI) composites are increasingly demanded in thermal interface materials (TIMs). Graphene woven fabrics (GWFs) with a mesh structure have been prepared by chemical vapor deposition and used as thermally conductive filler. With the incorporation of 10-layer GWFs laminates (approximate 12 wt%), the in-plane thermal conductivity of GWFs/PI composite films achieves 3.73 W/mK, with a thermal conductivity enhancement of 1418% compared to neat PI. However, the out-of-plane thermal conductivity of the composites is only 0.41 W/mK. The in-plane thermal conductivity exceeds its out-of plane counterpart by over 9 times, indicating a highly anisotropic thermal conduction of GWFs/PI composites. The thermal anisotropy and the enhanced in-plane thermal conductivity can be attributed to the layer-by-layer stacked GWFs network in PI matrix. Thus, the GWFs-reinforced polyimide films are promising for use as an efficient heat spreader for electronic cooling applications.

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