Subjects: Physics >> General Physics: Statistical and Quantum Mechanics, Quantum Information, etc. submitted time 2017-05-02
Abstract: The Fe3O4/SiO2/polythiophene [FSP] submicron composite [SC] with a structure of semiconductor/insulator/semiconductor [SIS] was obtained. The characterization results showed that the FSP SC had a spherical core/shell shape with an average diameter of 506
Peer Review Status:Awaiting Review