摘要: Heat accumulation is a severe problem for high-power light-emitting diodes (LEDs). Here, we introduce a thermostable and transparent lateral heat spreader as an additional heat-escaping channel of an LED chip to improve the thermal management of LED devices. The lateral heat spreader was prepared based on a silver nanowire (AgNW)/polyimide composite comprising a thin polyacrylate layer soldering a conductive AgNW network to confine the nanowires to the surface of a polyimide film and to obtain low contact resistance between the nanowires. The AgNW/polyimide composite film has a figure-of-merit sheet resistance of 7 ohm sq 1 with 76% transmittance at 550 nm. After heating at 200 C for 168 h, the sheet resistance increases to 16 ohm sq 1. The thermal conductivity and thermal diffusivity are 130.2 W m 1 K 1 and 60.5 mm2 s 1, respectively, which are comparable to those of a commercial copper foil. A demonstration shows the core temperature in a thermal diffusion apparatus can be lowered by 9 C. The experimental data combined with computational simulation indicate the Joule heating could be drawn away efficiently along the lateral heat spreader.
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期刊:
RSC ADVANCES
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分类:
物理学
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普通物理:统计和量子力学,量子信息等
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引用:
ChinaXiv:201705.00531
(或此版本
ChinaXiv:201705.00531V1)
doi:10.12074/201705.00531
CSTR:32003.36.ChinaXiv.201705.00531.V1
- 推荐引用方式:
Li, JP [Li, Junpeng][ 1 ],Qi, SH [Qi, Shuhua][ 1 ],Li, J [Li, Juan][ 2 ],Zhang, MY [Zhang, Mengyu][ 1 ],Wang, ZF [Wang, Zhaofu][ 1 ].(2017).A highly thermostable and transparent lateral heat spreader based on silver nanowire/polyimide composite.RSC ADVANCES.[ChinaXiv:201705.00531]
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